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MALDI/MS- Facility

ESCA/UPS/AES facility

Name of the Facility:

ESCA/UPS/AES facility

Year of Installation:

2007

Location of the Facility:

Block V Ground floor (Near ITMMEC workshop)*

Details of various functions

This new facility for surface characterization is going to be installed soon. It has three techniques such as XPS, AES and UPS for elemental, compositional and valance and core level studies. The system has sample preparation chamber with in-situ fracturing facility.

The sample charges are yet not decided.

Multi technique surface characterization, Fully computerized analysis and surface quality control

Features:

  • Fully computerized Surface Analysis
  • Automatic quantification
  • Nondestructive analysis
  • Exact sample positioning & monitoring With following options
  • Small spot ion source for depth profiling
  • Optical microscope for sample monitoring
  • Fine focus electron source for AES UV-source for UPS
  • X-Ray Monochromator
  • Preparation chamber for surface processing

Applications

  • Determination of layer thickness for hard disc production
  • Control of wafer surface composition between different processing steps
  • Composition analysis of bioactive surface
  • Depth profiling of chemical concentration profiles with nm resolution
  • Polymer surface composition checks following technological treatment
  • General quality control in microelectronic production lines
  • Adhesion problems on surfaces
  • Chemical composition analysis
  • Valance and core level studies

Contact Person: Dr. Mukesh Chander, Email: mukesh[at]physics.iitd.ac.in

IIT